Phase Change Thermal Interface Materials

Phase Change Thermal Interface Materials designed to replace the Silicone Grease as a heat transfer interface, for lower thermal resistance between power electronic devices and the heat sink, adhesive surface for many device package is very convenient to use. Its phase transition temperature (55°C-65°C) and above from the solid phase into a flow, these characteristics can be completely filled and the heat sink device interface gap to the small thermal resistance and heat transfer performance of the best. Phase change materials in our special formula designed to prevent the outflow from the interface. These problems are some of Silicone Grease and other manufacturers of the shortcomings of phase change materials.
Commonly used in computers and peripherals, high-performance computer processors, graphics cards, power supply module.
Provide sheet, roll form and custom die-cutting.