Thermally Conductive Liquid Gap Filling Materials

Thermally Conductive Liquid Gap Filling Materials are high performance, thermally conductive, liquid gap filling materials supplied as a two-component or single component, room or elevated temperature curing system. The material provides a balance of cured material properties and good compression set (memory).The result is a soft, form-in-place elastomer ideal for coupling “hot” electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, it flows under pressure like grease. After cure, it won't pump from the interface as a result of thermal cycling and is dry to the touch.
Commonly used in automotive electronics, communications equipment, computers and peripherals, thermal conductivity buffer earthquake, any heat between the semiconductor and heat sink.
Provide independent small packages or large volumes of bulk packaging.